Analysis of semiconductor components (BGA) with Avizo Fire

A Ball Grid Array (BGA) is a type of surface-mount packaging used for integrated circuits. It has been developed to provide a solution to the problem of producing a robust and convenient package for an integrated circuit with many hundreds of pins.

Its main advantages are:
- Improved connectivity
- Lower thermal resistance
- Shorter leads within the chip

The main issue with BGA components is that, once the package is soldered down, it is not possible to view the soldered connections using traditional optical methods. But X-ray inspection overcomes this problem.

Avizo Fire 3D imaging and analysis software provides a comprehensive set of tools to analyze the reliability of BGA components, enabling the accurate void analysis inside the solder balls. More info about Avizo Fire: http://www.avizo3d.com

Data ® nanoX Technology Pte Ltd