FC300R High Accuracy Die Bonder with Robotics

The FC300R offers production capabilities for Chip-to-Substrate or Chip-to-Wafer assembly as well as Chip-to-Chip stacking. With the unmatched post-bond accuracy of ± 0.5 µm, whatever force is used within the force range of the machine (up to 4,000N), the FC300R is the ideal tool for 3D-IC applications using high density TSV.

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