ReePrime
Thermosonic Bonding using Gold on Gold Process on FINEPLACER® lambda

Hosted by Dailymotion. For legal issues report at the Copyright Center, report us on DMC, or use the Instant Removal tool.

Thermosonic Bonding using Gold on Gold Process on FINEPLACER® lambda

F
fineplacer

64 Views • Jan 28, 2014

Description

Au on Au bonding process combines low temperature heat and force aided by ultrasonic motion - suitable for low to medium I/O count devices
Read more: http://eu.finetech.de/micro-assembly/technologies/ultrasonic-thermosonic-bonding.html