BGA Rework: removal using nitrogen

Read more:
http://eu.finetech.de/advanced-rework/applications/rework-of-bga-csp.html

The video demonstrates that in a nitrogen atmosphere, contamination of the solder is minimized , surface tension effects reduced, and a smooth spherical solder residue is left - making for a cleaner solder removal step without residual solder forming a meniscus (the typical "chocolate kiss" shape).